GP-558 Silicone Resin Based Conformal Coating

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GP-558 is a silicone polymer solution in toluene and isopropyl alcohol that can be used to encapsulate electronic components. GP-558 is applied by dipping, spraying, flow coating or brushing, followed by heat curing at 110º C (230º F) for one hour. Best results are obtained by allowing solvent to evaporate at room temperature, followed by heating to effect curing. The resulting clear, elastomeric film shows excellent heat stability and flexibility, providing protection from moisture, weathering and vibration to encapsulated components. GP-558 is a ready to use product requiring no curing additives. The following is a list summarizing some of the special features of GP-558:

  • Excellent Film Forming Properties
  • Flexible Over Wide Temperature Range
  • Weather and Heat Resistant
  • Good Release Properties
  • Contains Reactive (Curable) Silicone Polymer
  • Heat Curable (One Component Formula)
Typical Properties
Colorless, Slightly Hazy Liquid
Weight/Gallon @ 25°C
7.6 lbs
Flash Point (P.M.C.C.)
Specific Gravity
Viscosity (cPs) @ 25°C
12 cP
Wt. % Active


GP-558 is recommended for encapsulation of electronic components for the purpose of electrical insulation and protection against moisture.

Processing and Safety Guidelines

GP-558 is flammable. Use with adequate ventilation, and avoid contact with skin and eyes. Consult Safety Data Sheet for details.


GP-558 is supplied in 5-gallon (35 lbs.) pails and 55-gallon (400 lbs.) drums. Moisture Sensitive. Do not store above 90º F. Keep containers tightly sealed.